Patent Number: 6,294,743

Title: Multilayer print circuit board and the production method of the multilayer print circuit board

Abstract: The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other through a blind hole provided in the insulation layer. The insulation layer is composed of a resin insoluble in an oxidization agent and inorganic powder dispersed in the resin. The inorganic powder is soluble in the oxidization agent. The surface of insulation layer and the wall of the blind hole are roughed by the oxidization agent before the outer print circuit pattern is formed on the surface of the insulation layer by plating, whereby the inorganic powder exposed to the oxidization agent is melted therein, resulting in the roughed surface of the insulation layer and the wall of the blind hole.

Inventors: Kinoshita; Tohru (Fujisawa, JP)

Assignee: Victor Company of Japan, Ltd.

International Classification: H05K 3/42 (20060101); H05K 3/38 (20060101); H05K 3/46 (20060101); H05K 001/02 (); H05K 001/11 (); H01R 012/04 ()

Expiration Date: 09/25/2018