Patent Number: 6,294,745

Title: Solder anchor decal

Abstract: A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.

Inventors: Gruber; Peter Alfred (Mohegan Lake, NY)

Assignee: International Business Machines Corporation

International Classification: B23K 35/02 (20060101); H01L 21/02 (20060101); H01L 21/60 (20060101); H01L 21/48 (20060101); H05K 3/34 (20060101); H01R 012/04 (); H05K 001/11 ()

Expiration Date: 09/25/2018