Patent Number: 6,294,816

Title: Secure integrated circuit

Abstract: An integrated circuit is protected from reverse engineering by connecting doped circuit elements of like conductivity with a doped implant in the substrate, rather than with a metallized interconnect. The doped circuit elements and their corresponding implant interconnections can be formed in a common fabrication step with common implant masks, such that they have an integral structure with similar dopant concentrations. The metallization above the substrate surface can be designed to provide further masking of the interconnects, and microbridges can be added to span strips of transistor gate material in the interconnect path.

Inventors: Baukus; James P. (Westlake Village, CA), Clark, Jr.; William M. (Thousand Oaks, CA), Chow; Lap-Wai (Monterey Park, CA), Kramer; Allan R. (Simi Valley, CA)

Assignee: Hughes Electronics Corporation

International Classification: G11C 7/00 (20060101); G11C 7/24 (20060101); H01L 27/02 (20060101); H01L 23/58 (20060101); H01L 029/76 ()

Expiration Date: 09/25/2018