Patent Number: 6,294,825

Title: Asymmetrical mold of multiple-part matrixes

Abstract: The present invention relates to a method and system of encapsulating a plurality of chip and board pre-assemblies. Each pre-assembly has first and second surfaces. The method includes positioning a first mold half in a sealing relationship with each first surface of the pre-assemblies and positioning a second mold half adjacent each second surface of the pre-assemblies. The first mold half is filled first thereby forceing each second surface of the pre-assemblies into a sealing engagement with the second mold half. The second molding section is then filled, to result in an asymmetrically overmolded chip and board assembly.

Inventors: Bolken; Todd O. (Meridian, ID), Johnson; Mark S. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 23/31 (20060101); H01L 23/28 (20060101); H01L 21/00 (20060101); H01L 23/29 (20060101); H01L 021/44 (); H01L 021/48 (); H01L 021/50 ()

Expiration Date: 09/25/2018