Patent Number:
6,294,826
Title:
Molded electronic component having pre-plated lead terminals and manufacturing process thereof
Abstract:
A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor.
Inventors:
Ida; Yoshio (Tokyo, JP), Tainaka; Akiyoshi (Tokyo, JP)
Assignee:
NEC Corporation
International Classification:
C25D 5/00 (20060101); C25D 5/18 (20060101); H01G 9/00 (20060101); H01L 023/495 (); H01L 023/48 (); H01L 023/52 (); H01L 029/40 ()
Expiration Date:
09/25/2018