Patent Number: 6,294,826

Title: Molded electronic component having pre-plated lead terminals and manufacturing process thereof

Abstract: A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor.

Inventors: Ida; Yoshio (Tokyo, JP), Tainaka; Akiyoshi (Tokyo, JP)

Assignee: NEC Corporation

International Classification: C25D 5/00 (20060101); C25D 5/18 (20060101); H01G 9/00 (20060101); H01L 023/495 (); H01L 023/48 (); H01L 023/52 (); H01L 029/40 ()

Expiration Date: 09/25/2018