Patent Number: 6,294,828

Title: Semiconductor chip package

Abstract: A method for joining a semiconductor integrated circuit chip in a flip chip configuration, via solder balls, to solderable metal contact pads, leads or circuit lines on the circuitized surface of an organic chip carrier substrate, as well as the resulting chip package, are disclosed. The inventive method does not require the use of a solder mask, does not require the melting of the bulk of any of the solder balls and does not require the use of a fluxing agent.

Inventors: LaFontaine, Jr.; William Rena (Vestal, NY), Mescher; Paul Allen (Binghamton, NY), Woychik; Charles Gerard (Vestal, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/02 (20060101); H01L 21/60 (20060101); H01L 23/498 (20060101); H01L 21/603 (20060101); H01L 23/48 (20060101); H01L 023/48 (); H01L 029/40 (); H01L 031/028 (); H01L 029/12 (); H01L 029/20 ()

Expiration Date: 09/25/2018