Patent Number: 6,294,831

Title: Electronic package with bonded structure and method of making

Abstract: An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surface of the substrate. This reduces warp and deformation caused by temperature changes during package operation.

Inventors: Shishido; Itsuroh (Shiga-ken, JP), Matsumoto; Toshihiro (Shiga-ken, JP)

Assignee: International Business Machines Corporation

International Classification: H01L 21/02 (20060101); H01L 21/56 (20060101); H01L 23/367 (20060101); H01L 23/34 (20060101); H01L 023/06 (); H01L 023/22 (); H01L 023/34 ()

Expiration Date: 09/25/2018