Patent Number: 6,294,931

Title: Systems and methods for maintaining board signal integrity

Abstract: A circuit for altering a chip pad signal incorporates a primary driver that is configured to deliver a chip pad signal to an IC package. The circuit also is configured to cooperate with a second signal and a third signal, with the second signal having a voltage higher than the voltage of the first logic high, and the third signal having a voltage lower than the voltage of the first logic low. So configured, the primary driver may selectively deliver a second logic high, which has a voltage higher than the voltage of the first logic high, to the IC package, and may selectively deliver a second logic low, which has a voltage lower than the voltage of the first logic low, to the IC package. Electronic devices, systems and methods also are provided.

Inventors: Culler; Jason Harold (Livermore, CO)

Assignee: Agilent Technologies, Inc.

International Classification: H03K 19/003 (20060101); H03K 19/013 (20060101); H03K 19/01 (20060101); H03K 19/0175 (20060101); H03K 019/00 ()

Expiration Date: 09/25/2018