Patent Number: 6,294,966

Title: Interconnection device

Abstract: An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.

Inventors: Huang; River Guanghua (Prior Lake, MN), Chandler; Parker (Prior Lake, MN)

Assignee: HEI, Inc.

International Classification: H01L 23/66 (20060101); H01L 23/58 (20060101); H01L 023/043 ()

Expiration Date: 09/25/2018