Patent Number: 6,294,971

Title: Inverted board mounted electromechanical device

Abstract: A new board mounted electromechanical device is provided that mounts to a relay substrate to form a low profile reed relay. The reed relay is electrically connected to the electrical contacts via a signal traces and additional electrical traces located on the same side of the relay substrate which connect to the relay's signal and shielding. Additional traces on both sides of the signal traces of the reed relay provide a co-planar wave guide to maintain the desired impedance of the signal path. The reed relay is mounted in an inverted manner into a cut-out in the main circuit board so that the other portion of the reed relay itself is sits within the cut-out in the main circuit board. As a result, the reed relay component is recessed below the surface of the main circuit board resulting in an overall low profile circuit board.

Inventors: Martich; Mark E. (Barrington, RI)

Assignee: Kearney-National Inc.

International Classification: H01H 51/00 (20060101); H01H 51/28 (20060101); H05K 1/14 (20060101); H01H 1/00 (20060101); H01H 1/58 (20060101); H05K 1/18 (20060101); H05K 1/02 (20060101); H01H 001/66 (); H01H 051/00 ()

Expiration Date: 09/25/2018