Patent Number: 6,295,199

Title: Electronics module and a method of manufacturing such a module

Abstract: The module has a metal substrate having one major face that is insulated and that carries electrical connection tracks, and at least one power component fixed to the substrate and having connection tabs (20) that are soldered to the tracks. The power component is fixed on the non-insulated face and it is placed in a housing constituting an inside wall of a cooling fluid circuit, or it is stuck thereto. The tabs of the component pass through the substrate via holes therein.

Inventors: Le Gouil; Jean-Yves (Jouy-le-Moutier, FR)

Assignee: Sagem SA

International Classification: H01L 23/12 (20060101); H01L 23/14 (20060101); H01L 23/473 (20060101); H01L 23/34 (20060101); H05K 1/02 (20060101); H05K 3/34 (20060101); H05K 1/05 (20060101); H05K 007/20 ()

Expiration Date: 09/25/2018