Patent Number: 6,295,202

Title: Heatsink for actively cooled daughterboard system

Abstract: A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are radially displaced from one another. The base portion includes a central portion that is thicker than the end portions. The thickness of the base portion and the profile formed by the outer ends of the fins vary according to radii. The inner radius associated with the central fins is shorter than the inner radius associated with the endmost fins.

Inventors: Tucker; Sean W (Loveland, CO), Roesner; Arlen L (Ft Collins, CO), Smith; Darren B (Loveland, CO), Trotter; Donald (Loveland, CO), Delano; Andrew D (Ft. Collins, CO)

Assignee: Hewlett-Packard Company

International Classification: G06F 1/20 (20060101); H01L 23/367 (20060101); H01L 23/34 (20060101); H01L 23/467 (20060101); H05K 7/20 (20060101); H05K 007/20 ()

Expiration Date: 09/25/2018