Patent Number: 6,295,209

Title: Semiconductor device including combed bond pad opening, assemblies and methods

Abstract: A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.

Inventors: Farnworth; Warren M. (Nampa, ID), Moden; Walter L. (Meridian, ID), Kinsman; Larry D. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/32 (20060101); H01L 23/48 (20060101); H05K 007/10 ()

Expiration Date: 09/25/2018