Patent Number: 6,297,478

Title: Thermal processing apparatus for a band film

Abstract: A heating unit includes a pair of heating bodies for heating a band film conveyed along a predetermined film feeding path defined by a film guide. An embossing unit includes a punch and a die for forming a predetermined raised pattern on a heated surface of the band film. A shifting mechanism locates the heating unit and the embossing unit closely by a first distance during a thermal processing of the band film and separates at least one of the heating unit and the band film far away from the other by a second distance larger than the first distance when the thermal processing is interrupted or stopped.

Inventors: Kano; Yoshinobu (Osaka, JP), Tsumura; Tetsuya (Osaka, JP), Murakami; Kazuhiro (Osaka, JP), Miyazaki; Osamu (Osaka, JP), Hino; Kiyoshi (Osaka, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: B29B 13/02 (20060101); B29B 13/00 (20060101); B29C 51/42 (20060101); B29C 51/26 (20060101); B29C 51/08 (20060101); B65B 047/02 (); B29C 059/02 ()

Expiration Date: 10/02/2018