Patent Number: 6,297,480

Title: Method and apparatus for preventing contamination in a hot plate oven

Abstract: A method and an apparatus for preventing particle contamination in a hot plate oven for curing a coating layer on a wafer surface are disclosed. The apparatus of a hot plate oven for curing a coating layer on the wafer without particle contamination can be constructed with an oven body of elongated shape; a plurality of metal heating blocks situated in the oven body arranged in a matrix form with a preset spacing there in-between; a pair of metal wafer carrying blades positioned in preset spacing between the plurality of metal heating blocks for moving both in a longitudinal direction of the oven body to traverse a wafer and in a vertical direction to load or unload the wafer from a planar top surface of the metal heating blocks; and an interlocking circuit for detecting an electrical short between any one of the pair of metal wafer carrying blades and any one of the plurality of metal heating blocks and for stopping the movement of the pair of metal wafer carrying blades when such electrical short is detected.

Inventors: Liu; Liang Huang (Miaoli, TW), Lin; Shu Shing (Tainan, TW)

Assignee: Taiwan Semiconductor Manufacturing Company, Ltd

International Classification: H01L 21/00 (20060101); F27D 011/00 ()

Expiration Date: 10/02/2018