Patent Number: 6,297,542

Title: Connecting a die in an integrated circuit module

Abstract: An integrated circuit module having sockets adapted to receive direct die contact (DDC) dies. Bond pads on each DDC die is arranged such that they are displaced with respect to one another along a particular direction. Each socket of a module includes spring arms adapted to contact the bond pads so configured on the die. The socket includes multiple types of spring arms of varying lengths.

Inventors: Farnworth; Warren M. (Nampa, ID), Kinsman; Larry D. (Boise, ID), Moden; Walter L. (Meridian, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/52 (20060101); H01L 23/48 (20060101); H01L 23/538 (20060101); H01L 023/495 ()

Expiration Date: 10/02/2018