Patent Number: 6,297,547

Title: Mounting multiple semiconductor dies in a package

Abstract: A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The first die, second die, and leadframe are encapsulated in a package.

Inventors: Akram; Salman (Boise, ID)

Assignee: Micron Technology Inc.

International Classification: H01L 23/495 (20060101); H01L 23/48 (20060101); H01L 023/495 ()

Expiration Date: 10/02/2018