Patent Number: 6,297,548

Title: Stackable ceramic FBGA for high thermal applications

Abstract: An apparatus package for high temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices.

Inventors: Moden; Walter L. (Meridian, ID), Corisis; David J. (Meridian, ID), Mess; Leonard E. (Boise, ID), Kinsman; Larry D. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/12 (20060101); H01L 23/13 (20060101); H01L 25/10 (20060101); H01L 023/02 (); H01L 023/22 (); H01L 023/34 (); H01L 023/12 (); H01L 023/48 ()

Expiration Date: 10/02/2018