Patent Number: 6,297,551

Title: Integrated circuit packages with improved EMI characteristics

Abstract: The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization. The normally exposed top and side surfaces of the MCM package are also metallized. A solder wall is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.

Inventors: Dudderar; Thomas Dixon (Chatham, NJ), Kossives; Dean Paul (Glen Gardner, NJ), Low; Yee Leng (Berkeley Heights, NJ)

Assignee: Agere Systems Guardian Corp.

International Classification: H01L 23/055 (20060101); H01L 23/498 (20060101); H01L 23/552 (20060101); H01L 23/48 (20060101); H01L 23/02 (20060101); H05K 3/34 (20060101); H05K 1/14 (20060101); H05K 1/02 (20060101); H01L 023/34 ()

Expiration Date: 10/02/2018