Patent Number: 6,297,553

Title: Semiconductor device and process for producing the same

Abstract: A semiconductor device that meets the demand for realizing semiconductorchips in small sizes. A semiconductor device in which connection lands 20formed on the electrode terminal carrying surface of a semiconductor chip10 are electrically connected, through connection bumps 14, to connectionpads 22 formed on one surface of an interposing substrate 12 of aninsulating material so as to face the connection lands 20, whereinconductor wiring patterns 24 inclusive of the connection pads 22 areformed on one surface of the interposing substrate 12, conductor wiringpatterns 30 inclusive of terminal lands on where the external connectionterminals 26 will be mounted, are formed on the other surface of theinterposing substrate 12, and the conductor wiring patterns 24 formed onone surface of the interposing substrate 12 are connected to the conductorwiring patterns 30 formed on the other surface of the interposingsubstrate 12 through vias 32 formed by filling recesses with a metal byplating, the recesses being formed to penetrate through the insulatingmaterial of the interposing substrate 12 and permitting the back surfacesof the conductor wiring patterns 24 on the side of the insulating materialto be exposed on the bottom surfaces thereof.

Inventors: Horiuchi; Michio (Nagano, JP), Imai; Kazunari (Nagano, JP)

Assignee:

International Classification:

Expiration Date: 10/02/2013