Patent Number: 6,297,560

Title: Semiconductor flip-chip assembly with pre-applied encapsulating layers

Abstract: A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.

Inventors: Capote; Miguel A. (Carlsbad, CA), Zhu; Xiaoqi (Vista, CA)

Assignee: Capote; Miguel Albert

International Classification: B23K 35/36 (20060101); B23K 35/02 (20060101); B32B 7/12 (20060101); C09J 4/00 (20060101); H01L 21/02 (20060101); H01L 21/60 (20060101); H01L 21/56 (20060101); H01L 23/433 (20060101); H01L 23/498 (20060101); H01L 23/48 (20060101); H01L 23/34 (20060101); H05K 3/32 (20060101); H05K 1/09 (20060101); H01L 023/48 ()

Expiration Date: 10/02/2018