Patent Number: 6,297,562

Title: Semiconductive chip having a bond pad located on an active device

Abstract: A semiconductive chip having at least one active device, and at least one bond pad located on said active device. The bond pad has at least one deformable member, and the deformable member is deformable when conductive stud is bonded to said bond pad so as to prevent damage to the active device during the bonding of the conductive stud to the bond pad, such as by an ultrasonic bonding technique. A plurality of the deformable members may define a pattern on the bond pad that deforms when the conductive stud is bonded to the bond pad.

Inventors: Tilly; Lars (Malmo, SE)

Assignee: Telefonaktieboalget LM Ericsson (publ)

International Classification: H01L 21/02 (20060101); H01L 21/60 (20060101); H01L 23/485 (20060101); H01L 23/48 (20060101); H01L 023/48 ()

Expiration Date: 10/02/2018