Patent Number: 6,297,658

Title: Wafer burn-in cassette and method of manufacturing probe card for use therein

Abstract: A wafer tray has a wafer mount portion for carrying a semiconductor wafer formed with a plurality of semiconductor chips. A probe card composed of an elastic material and disposed in opposing relation to the wafer mount portion of the wafer tray has bumps to be connected to the respective electrode pads of the semiconductor chips on the top surface thereof. A holding board is provided to hold the back surface of the probe card. An annular sealing member is disposed on the wafer tray externally of the wafer mount portion and defines a first sealed space in combination with the wafer tray and the probe card. The probe card has connection holes for connecting the first sealed space to a second sealed space formed between the probe card and the holding board.

Inventors: Nakata; Yoshiro (Kyoto, JP), Oki; Shinichi (Osaka, JP)

Assignee: Matsushita Electric Industrial Co., Ltd.

International Classification: G01R 1/073 (20060101); G01R 031/28 ()

Expiration Date: 10/02/2018