Patent Number: 6,297,721

Title: Electronic surface mount package

Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking. A reinforcement beam is located laterally across the bottom of the package to provide mechanical strength for the case.

Inventors: Lu; Peter (Flower Mound, TX), Heaton; Jeffrey (Cupertino, CA), Heaton; James W. (Los Altos, CA), Sun; Tsang Kei (Kowloon, HK), Pao; Peter Loh Hang (Kowloon, HK), Lam; Robert Loke Hang (Kowloon, HK)

Assignee: Halo Electronics, Inc.

International Classification: H01F 27/02 (20060101); H01R 13/66 (20060101); H01F 027/02 (); H01F 027/28 ()

Expiration Date: 10/02/2018