Patent Number: 6,297,722

Title: Surface mountable electrical device

Abstract: A process for manufacturing surface mountable electrical devices includes the steps of preparing a PTC resistive plate, covering the plate with first and second conductive layers to form a laminate, forming a plurality of spaced apart bores of cross-shaped cross-section in the laminate along intersecting cutting lines at locations where the cutting lines intersect, electroplating the first and second conductive layers and the cross-shaped bores, and cutting the laminate along the cutting lines to form a plurality of polygonal elements with each of the bores being divided into four parts, each having a substantially L-shaped cross-section.

Inventors: Yeh; Ching-Chiang (Taipei Hsien, TW)

Assignee: Fuzetec Technology Co., Ltd.

International Classification: H01C 7/02 (20060101); H01C 1/14 (20060101); H05K 3/34 (20060101); H01C 007/10 ()

Expiration Date: 10/02/2018