Patent Number: 6,297,960

Title: Heat sink with alignment and retaining features

Abstract: An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.

Inventors: Moden; Walter L. (Meridian, ID), Corisis; David J. (Meridian, ID), Kinsman; Larry D. (Boise, ID), Mess; Leonard E. (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: H01L 23/367 (20060101); H01L 23/34 (20060101); H01L 25/10 (20060101); H05K 007/20 ()

Expiration Date: 10/02/2018