Patent Number: 6,297,961

Title: Semiconductor module and heat sink used in such module

Abstract: A semiconductor module includes a circuit board provided with a plurality of attachment holes and semiconductor elements or semiconductor devices mounted on the circuit board and a pair of metallic plates. The circuit board is disposed, between the pair of metallic plates, in such a manner that spaces are defined between the circuit board and the pair of metallic plates for accommodating the semiconductor elements or semiconductor devices when the pair of metallic plates are attached to the circuit board. One of the metallic plates is provided at positions corresponding to the attachment holes with through holes and the other metallic plate is provided at positions corresponding to the attachment holes with tubular projections having a length larger than a sum of a thickness of the circuit board and a thickness of the one metallic plate. The tubular projections are inserted into the attachment holes and the through holes and tip ends of the tubular projections are enlarged to firmly attach the pair of metallic plates to the circuit board.

Inventors: Koizumi; Shoji (Nagano, JP), Komatsu; Hiroyuki (Nagano, JP)

Assignee: Shinko Electric Industries Co., Ltd.

International Classification: H05K 1/02 (20060101); H05K 7/20 (20060101); H05K 007/20 ()

Expiration Date: 10/02/2018