Patent Number: 6,297,995

Title: Circuit configuration with a temperature-dependent semiconductor component test and repair logic circuit

Abstract: A circuit configuration with a temperature-dependent semiconductor component self-test and repair logic circuit, in which at least one temperature sensor is provided in a semiconductor chip having a semiconductor component. In addition, the semiconductor component is connected in the semiconductor chip with the self-test and repair logic circuit.

Inventors: Mc Connell; Roderick (Munchen, DE), Richter; Detlev (Munchen, DE)

Assignee: Siemens Aktiengesellschaft

International Classification: G01R 31/28 (20060101); G01R 31/30 (20060101); G11C 011/22 ()

Expiration Date: 10/02/2018