Patent Number: 6,298,149

Title: Semiconductor device image inspection with contrast enhancement

Abstract: Machine vision methods for inspection of semiconductor die lead frames include the steps of generating a first image of the lead frame, generating a second image of the lead frame and any defect thereon, and subtracting the second image from the first image. The methods are characterized in that the second image is generated such that subtraction of it from the first image emphasizes the defect with respect to the lead frame.

Inventors: Nichani; Sanjay J. (Newton, MA), Scola; Joseph (Medfield, MA)

Assignee: Cognex Corporation

International Classification: G01N 21/956 (20060101); G01N 21/88 (20060101); G06T 005/50 ()

Expiration Date: 10/02/2018