Patent Number: 6,298,191

Title: Splice mount having improved structural integrity and method of making

Abstract: A splice mount and method of making a splice mount having improved structural integrity for telecommunications applications. The splice mount is formed by a two-directional molding process so that resilient holding pockets are separated into groups and remain interconnected to each other by a continuous strip. The continuous strip increases the structural integrity of the splice mount relative to prior art splice mounts.

Inventors: Daoud; Bassel Hage (Parsippany, NJ)

Assignee: Lucent Technologies, INc.

International Classification: G02B 6/38 (20060101); G02B 6/44 (20060101); G02B 006/00 ()

Expiration Date: 10/02/2018