Patent Number: 6,305,067

Title: Elastic plate structure for preventing electromagnetic interference and manufacturing method for the same

Abstract: A manufacturing method of elastic plate structure for preventing electromagnetic interference comprises step of: preparing a Be--Cu plate and performing thermal treatment to the Be--Cu plate; electroplating the Be--Cu plate; punching and processing the Be--Cu plate to form elastic plate structure for preventing EMI. The above-manufactured Be--Cu plate has the advantages of excellent conductivity, flexibility, low resistance and non-oxidation, thus providing added-value to product using the elastic plate structure.

Inventors: Horng; Chin Fu (Taipei Hsien, TW)

Assignee:

International Classification: C22F 1/08 (20060101); G06F 1/18 (20060101); H01R 43/16 (20060101); H01R 13/03 (20060101); H05K 9/00 (20060101); H01R 13/658 (20060101); B23P 025/00 ()

Expiration Date: 10/23/2018