Patent Number: 6,305,074

Title: Support for integrated circuit and process for mounting an integrated circuit on a support

Abstract: The process for mounting an integrated circuit (11) on a support (10) comprising a structure (13) of conductors (14) comprises connecting the conductors to respective terminals (12) of the integrated circuit without interposing a part of the support for insulating the conductors of the integrated circuit as in the standard TAB technology. The connection can be made directly by thermocompression or ultrasound, or indirectly through ball bonds. It is only after the connection that the insulation between the conductors and the integrated circuit is applied. The insulating substrate of the TAB support (10) can be attached to the conductors outside the integrated circuit, before or after the connection of the conductors.

Inventors: Courant; Patrick (Viroflay, FR)

Assignee: Bull, S.A.

International Classification: H01L 21/60 (20060101); H01L 21/02 (20060101); H01R 043/00 ()

Expiration Date: 10/23/2018