Patent Number: 6,305,194

Title: Mold and compression molding method for microlens arrays

Abstract: A method and apparatus is disclosed for compression molding arrays optical elements which may be later singulated. The apparatus includes first and second mold halves with the second mold half having a central nest and a plurality of predetermined negative optical surface features therein. A glass preform is placed in the central nest and the first and second mold halves and the glass preform are heated to at least the glass transition temperature of the glass preform. The glass preform is then pressed between the first and second mold halves to thereby form an integral array of optical elements with each of the optical elements being a positive of the predetermined negative optical surface features. The integrally formed array of optical elements is then cooled to below the glass transition temperature and removed from the first and second mold halves.

Inventors: Budinski; Michael K. (Pittsford, NY), Nelson; Jayson J. (Webster, NY), Bourdage; Phillip D. (Penfield, NY), Richards; David A. (Rochester, NY), McLaughlin; Paul O. (Rochester, NY), Ludington; Paul D. (Brockport, NY)

Assignee: Eastman Kodak Company

International Classification: C03B 11/06 (20060101); C03B 11/08 (20060101); C03B 023/02 ()

Expiration Date: 10/23/2018