Patent Number: 6,305,230

Title: Connector and probing system

Abstract: A connection device and test system is capable of stable, low load damage-free probing of devices under test, which have many pins with a narrow pitch. Furthermore in order to achieve high speed exchange of electrical signals or so-called high frequency electrical signals, a support member is provided for supporting the connection device, a plurality of pointed contact terminals are arrayed in an area on the probing side, a multilayer film is provided having a plurality of lead out wires electrically connected to the contact terminals and a ground layer enclosing an insulation layer, and a frame is clamped on the rear side of the multilayer film. A clamping member is provided on the frame to make the multilayer film project out to eliminate slack in the multilayer film, a contact pressure means is provided for making the tips of the contact terminals contact each of the electrodes with predetermined contact pressure from the support member to the clamping member, and a compliance mechanism is provided so that the contact terminal group of the tip surface is arrayed in parallel with the electrode group terminal surface, so that the tips of the contact terminals contact the surface of the electrodes with an equal pressure.

Inventors: Kasukabe; Susumu (Yokohama, JP), Mori; Terutaka (Urayasu, JP), Ariga; Akihiko (Musashimurayama, JP), Shigi; Hidetaka (Hakone-machi, JP), Watanabe; Takayoshi (Fujisawa, JP), Kono; Ryuji (Chiyoda-machi, JP)

Assignee: Hitachi, Ltd.

International Classification: G01R 1/073 (20060101); G01L 001/00 ()

Expiration Date: 10/23/2018