Patent Number: 6,305,463

Title: Air or liquid cooled computer module cold plate

Abstract: A cold plate that provides air or liquid cooling for a computer circuit module and has at least one mounting plate with a board mounting surface on one side for carrying a printed circuit board assembly and a cooling surface located on the other side. A cover is disposed parallel to and spaced apart from the mounting plate with a cooling chamber defined between the two. The cooling chamber is divided into a liquid cooled section and an air cooled section. The liquid cooled section has a coolant inlet and outlet and flow channels for directing coolant through the liquid cooled section from inlet to outlet. The air cooled section has an air inlet and outlet and flow channels for directing air through the air cooled section from inlet to outlet. The cold plate is adapted so that it may be installed into a circuit module and provide either liquid cooling or air cooling for the module.

Inventors: Salmonson; Richard B. (Chippewa Falls, WI)

Assignee: Silicon Graphics, Inc.

International Classification: G06F 1/20 (20060101); H05K 7/20 (20060101); H05K 007/20 ()

Expiration Date: 10/23/2018