Patent Number: 6,305,593

Title: Lead penetrating clamping system

Abstract: An apparatus and method of forming improved wire bonds between the contactpads on semiconductor devices and individual lead frame fingers of a leadframe. The apparatus and method includes the use of a penetratingindividual independent lead finger clamp during the wire bonding processto provide increased stability of the individual lead finger for improvedbonding by the clamp penetrating a portion of the lead finger beingbonded. If desired, the apparatus and method also provides for the use ofeither a penetrating or non-penetrating fixed clamp for the lead fingersduring the wire bonding process in addition to the penetrating individualindependent lead finger clamp during the wire bonding process to provideincreased stability of the individual lead finger for improved bonding.The apparatus and method contemplates the replacement of the penetratingfixed clamp with another, or second, penetrating independent clamp inaddition to the first individual independent lead finger clamp during thewire bonding process.

Inventors: Ball; Michael B. (Boise, ID)

Assignee:

International Classification:

Expiration Date: 10/23/2013