Patent Number: 6,305,594

Title: Wire bonding method and apparatus

Abstract: So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as a reference bonding position; and during the looping for the remaining wires, the bonding tool is moved in accordance with an amount of movement stored beforehand in the memory with the reference bonding position used as a reference.

Inventors: Mochida; Toru (Higashiyamato, JP), Nishiura; Shinichi (Fussa, JP)

Assignee: Kabushiki Kaisha Shinkawa

International Classification: B23K 20/00 (20060101); B23K 037/00 (); B23K 031/02 ()

Expiration Date: 10/23/2018