Patent Number: 6,305,595

Title: Die set for welding a panel like heat pipe to a heat sink

Abstract: A die set for welding a panel like heat pipe to a heat sink, by the die set used in welding, the heat pipe with extremely high heat conductivity is effectively combined with the heat sink for use. Thereby, the heat sink can have better heat-conducting efficiency and working of it is fast and convenient. The die set includes a first and a second die seat. The first die seat is placed under a heat conductive bottom plate, and the top thereof has a first frame-like stub of which the top surface has a lot of protruding granules. The second die seat is placed above a heat conductive top plate, and the bottom thereof has a second frame-like stub (opposite to the first die seat) of which the bottom surface also has a lot of protruding granules. The top plate is lapped over the bottom plate with a connecting frame therebetween in opposition to and having a shape similar to that of any of the first and second frame-like stubs. The connecting frame is in a vacuum state internally, and is provided therein with a capillary structure and condensate. The end faces of the first and the second frame-like stubs are treated by pulsation with high periodic waves to integrally combine the connecting frame with the top plate and the bottom plate, thereby the top and the bottom plates form a heat sink with a panel-like heat pipe.

Inventors: Chen; Yang-Shiau (Taipei, TW)

Assignee:

International Classification: B23K 11/00 (20060101); F28D 15/02 (20060101); F28D 15/04 (20060101); B23K 037/00 (); B23K 031/02 (); B23P 006/00 ()

Expiration Date: 10/23/2018