Patent Number: 6,305,596

Title: Apparatus and method for soldering through-hole components on circuit board

Abstract: A method for breaking off solder bridges between pins of a through-holecomponent on a printed circuit board, comprises the following steps: (1)providing a soldering apparatus, the apparatus having an openingcorresponding to the through-hole component, the opening defining anopening wall surface, providing a slit at a predetermined position of theopening wall surface; and (2) blowing a gas of a predetermined temperatureand a predetermined pressure at a predetermined time to the position ofthe solder bridges through the slit for removing the solder bridges fromthe through-hole component.

Inventors: Lin; Shui-Town (Taipei, TW), Chuang; Shih-Ren (Taipei, TW)

Assignee:

International Classification:

Expiration Date: 10/23/2013