Patent Number: 6,305,677

Title: Perimeter wafer lifting

Abstract: The invention relates to an apparatus for lifting a substrate from a surface of a chuck subsequent to a processing step. The apparatus includes a perimeter pin for lifting the substrate from the surface of the chuck to a first position wherein the substrate is disposed on the perimeter pin during lifting. The perimeter pin is configured to overcome a holding force at an interface of the substrate and the surface. Generally, the holding force is generated between the substrate and the surface during the processing step. The apparatus further includes a center pin for moving the substrate from the first position to a second position wherein the substrate is disposed on the center pin during moving. The second position is further away from the surface of the chuck than the first position.

Inventors: Lenz; Eric H. (San Jose, CA)

Assignee: Lam Research Corporation

International Classification: H01L 21/683 (20060101); H01L 21/67 (20060101); B25B 001/00 ()

Expiration Date: 10/23/2018