Patent Number: 6,305,921

Title: Saw tooth mold

Abstract: A device and method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The device is formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.

Inventors: Grams; Gary O. (Ankeny, IA), Peterson; Greg S. (Nevada, IA)

Assignee: Accu-Mold Corp.

International Classification: B29C 45/14 (20060101); H01L 21/56 (20060101); H01L 21/02 (20060101); B29C 033/12 (); B29C 045/14 ()

Expiration Date: 10/23/2018