Patent Number: 6,305,923

Title: Molding system using film heaters and/or sensors

Abstract: Improved mold manifold and hot runner nozzle using thin film elements include at least one active or passive thin film element disposed along a melt channel between the manifold inlet and the hot runner nozzle. Preferably, the thin film element may comprise a thin film heater in direct contact with the molten resin and position to aid in the heat and flow management of the resin within the melt channel. Thin film temperature sensors, pressure sensors, and leak detectors may also be provided in the vicinity of the melt channel to enhance process control in the injection molding machine.

Inventors: Godwin; Harold (Brampton, CA), Olaru; George (North York, CA), Whiffen; David (Bolton, CA)

Assignee: Husky Injection Molding Systems Ltd.

International Classification: B29C 45/27 (20060101); B29C 45/16 (20060101); B29C 045/20 (); B29C 045/77 ()

Expiration Date: 10/23/2018