Patent Number: 6,308,369

Title: Wafer cleaning system

Abstract: A wafer cleaning apparatus provides two opposed brushes for brushing a vertically disposed wafer in a tank which can contain a process liquid. A pressure controller adaptively controls the pressure exerted by the brushes on the wafer to compensate for brush wear. Rim driving wheels engage the wafer periphery with a porous jacket coupled to a fluid delivery system, thereby simultaneously rotating and cleaning the periphery of the wafer. The apparatus includes a fluid delivery system for separately and independently delivering a plurality of constituents of a cleaning solution to the brushes, thereby ensuring that a freshly mixed cleaning solution reaches the wafer. The tank can be filled with a process liquid through which megasonic waves provided by a transducer can propagate and impinge upon the wafer thereby enhancing the cleaning of the wafer or the brushes.

Inventors: Garcia; Alejandro (Union City, CA), Krick; Brent (Mountain View, CA), Nichtawitz; Anthony (Lima, PE), Nordeen; Daniel (Boulder Creek, CA), Oen; Josh (Fremont, CA), Smith; Kenneth (Cupertino, CA), Suro; Vincent (Sunnyvale, CA), Wolf; Daniel (San Jose, CA)

Assignee: Silikinetic Technology, Inc.

International Classification: H01L 21/00 (20060101); B08B 001/04 ()

Expiration Date: 10/30/2018