Patent Number: 6,308,389

Title: Ultrasonic transducer and manufacturing method therefor

Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. First, a plurality of printed boards in each of which a plurality of leads are formed in a line are stacked. The end portions of the leads protrude from each printed board. These lead end portions are inserted into a plurality of lead holes of an alignment jig. The plurality of printed boards are buried in the back surface of this alignment jig, and a backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.

Inventors: Tezuka; Satoru (Nasu-gun, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: B06B 1/06 (20060101); H04R 017/00 ()

Expiration Date: 10/30/2018