Patent Number: 6,308,579

Title: Apparatus and methods for forming a bond strength adherend

Abstract: Apparatus and methods for forming an adherend and bonding the adherend to a test piece. A bonding and molding platform is used to form a cylindrically shaped adherend that is bonded to the test piece. The bonding and molding platform limits the bond site to a particular area on the test piece. The bonding and molding platform forms an adherend that is substantially cylindrically shaped and substantially perpendicular to the substrate.

Inventors: Jessop; Neil T. (Colton, CA), Wagner; Jeff A. (Draper, UT)

Assignee: Ultradent Products, Inc.

International Classification: A61C 13/20 (20060101); G01N 19/04 (20060101); G01N 3/00 (20060101); G01N 3/24 (20060101); G01N 19/00 (20060101); G01N 3/04 (20060101); G01N 003/24 ()

Expiration Date: 10/30/2018