Patent Number: 6,308,894

Title: IC module, method of manufacturing the same and IC card provided with IC module

Abstract: In the method of manufacturing an IC module (1) including a resin packaging process using upper and lower dies (5) for forming a cavity (50) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (2) on which an IC chip (3) is placed and a coil (20A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (50). When a substrate (2) on which an antenna coil (20) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (28) having an equal and almost equal height to the height of the cavity (50) on the substrate (2), housing it in the cavity (50), and introducing a melted resin. Instead of forming the spacer (28) on the substrate (2), a substrate (2) housed in a cavity (50) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.

Inventors: Hirai; Minoru (Kyoto, JP), Ueda; Shigeyuki (Kyoto, JP), Miyata; Osamu (Kyoto, JP), Horio; Tomoharu (Kyoto, JP)

Assignee: Rohm & Co., Ltd.

International Classification: B29C 45/14 (20060101); G06K 19/077 (20060101); B29C 45/00 (20060101); G06K 019/06 ()

Expiration Date: 10/30/2018