Patent Number: 6,308,938

Title: Semiconductor integrated circuit device

Abstract: A semiconductor integrated circuit device having a ball grid array package includes a core material including a semiconductor chip and a sealing resin layer surrounding the chip and surface materials including a carrier base and a reinforcement in a sandwich structure for high stiffness against being and high reliability of connection to a printed wiring board even during heat cycling.

Inventors: Futakuchi; Michio (Tokyo, JP)

Assignee: Mitsubishi Denki Kabushiki Kaisha

International Classification: H01L 23/28 (20060101); H01L 23/16 (20060101); H01L 23/31 (20060101); H01L 023/48 ()

Expiration Date: 10/30/2018