Patent Number: 6,309,279

Title: Arrangements for wafer polishing

Abstract: Wafer polishing systems include a series of polish modules alongside a neighboring series of secondary modules. A conveyor travels along the series of polish modules and the series of secondary modules. When a polishing operation is completed, the wafers are transferred to a series of near-by storage modules. The polish modules include a pair of traveling wafer gantries, each of which delivers a wafer to a polishing surface, applying the necessary force to complete polishing of the wafer surface.

Inventors: Bowman; Mike L. (Chandler, AZ), Hempel; Gene (Gilbert, AZ), Karlsrud; Chris (Chandler, AZ), Root; Franklin D. (Phoenix, AZ)

Assignee: Speedfam-IPEC Corporation

International Classification: B24B 41/00 (20060101); B24B 37/04 (20060101); H01L 21/00 (20060101); B24B 001/00 (); B24B 005/00 (); B24B 007/19 ()

Expiration Date: 10/30/2018