Patent Number: 6,309,280

Title: Method of grinding semiconductor articles

Abstract: Disclosed is a method of grinding semiconductor articles comprising the steps of: dicing a semiconductor wafer having bumps formed on one surface into individual chips or pellets; putting the pellets on a printed-wiring board with their flat, bump-less surfaces up; bonding the bumps of the pellets to the electrodes of the printed-wiring board; and grinding the flat, bump-less surfaces of the pellets simultaneously so that they may have a predetermined reduced thickness. The grinding post bonding has the advantageous effect of preventing pellets from being broken or fractured.

Inventors: Kaneda; Yukihiro (Tokyo, JP), Takizawa; Shuichi (Tokyo, JP)

Assignee: Disco Corporation

International Classification: B24B 41/06 (20060101); B24B 7/22 (20060101); B24B 7/20 (20060101); H01L 21/70 (20060101); H01L 21/02 (20060101); H01L 21/304 (20060101); H01L 21/78 (20060101); B24B 001/00 ()

Expiration Date: 10/30/2018