Patent Number: 6,309,433

Title: Polishing pad conditioner for semiconductor substrate

Abstract: There is provided a conditioner which eliminates loading of a polishingpad, stabilizes polishing speeds and has a long usable life in metal CMPemploying acidic slurry, which allows production of semiconductors at highquality and high yield, and which is characterized in that diamond grainsare supported by monolayer brazing in a supporting material comprising ametal and/or alloy, using an alloy with a melting point C. which contains 0.5-20 wt % of at least one metalselected from among titanium, zirconium and chromium and 30-99.5 wt % ofat least one metal selected from among gold, platinum and silver.

Inventors: Kinoshita; Toshiya (Kawasaki, JP)


International Classification:

Expiration Date: 10/32013